FlipChip Electronics Pvt. Ltd
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World-Class Manufacturing, Built for Precision

Over 15,000 sq. ft. of ISO 9001-2015-certified production space, housing advanced SMT lines, automated inspection systems, and a quality lab that sets the standard for electronics manufacturing in India.

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ISO 9001:2015 Certified
IPC-A-610 Class 2 & 3
RoHS & REACH Compliant
ESD-Safe Facility
Equipment & Machinery

Equipped for Every Challenge

Precision machinery for high-quality electronics manufacturing.

High-Speed SMD Pick & Place
SMD

High-Speed SMD Pick & Place

Yamaha · YSM20

The Yamaha YSM20 is a high-speed, high-precision pick & place system engineered for demanding SMT production environments. Featuring a dual X-axis 2-beam configuration with 20 nozzles, it delivers exceptional throughput, flexible component handling from 0201 metric chips to large ICs, and a wide PCB range for both single and dual-stage conveyance.

Model

YSM20

Make

Yamaha

Type

High-Speed Pick & Place

Mounting Speed

Up to 95,000 CPH

Mounting Head

X-axis 2-beam: 2 heads, 10 nozzles each

PCB Size (Single Lane)

L810 × W490 to L50 × W50 mm

PCB Size (Dual Stage)

L380 × W490 to L50 × W50 mm

Mounting Accuracy

±0.035mm (±0.025mm) Cpk ≥1.0 (3σ)

Component Size

0201 metric to 55×100mm

Component Height

Up to 28mm

Tape Feeder Capacity (8mm)

Max 140 types (fixed) / 128 types (exchange)

Tray Capacity

Up to 10 types (carriage type)

Flexible Mounter Pick & Place
PCB Assembly

Flexible Mounter Pick & Place

Yamaha, Japan · YS12F

The Yamaha YS12F is a high-flexibility pick & place mounter designed for medium to high-mix production runs. With a single head carrying 5 nozzles and a broad component range including BGA and CSP, it delivers reliable placement accuracy and versatile feeder compatibility for both prototype and volume assembly.

Model

YS12F

Make

Yamaha, Japan

Type

Flexible Mounter

Mounting Speed

Up to 20,000 CPH

Mounting Head

Single head with 5 nozzles

Applicable PCB

L510 × W460mm to L50 × W50mm

Mounting Accuracy

±0.05mm / chip

Component Range

0402 metric chips up to 45×100mm (incl. BGA, CSP)

Tape Feeders

Up to 106 types (8mm equivalent)

Tray Feeders

Up to 15 types (JEDEC tray)

Solder Paste Printer
Printing

Solder Paste Printer

HIT · HIT 520L

The HIT 520L is a fully capable solder paste printer with precision squeegee control and automated stencil cleaning. Offering a maximum board size of 450×350mm, a fast cycle time under 8 seconds, and flexible squeegee angles, it ensures consistent paste deposition for high-quality SMT assembly.

Model

HIT 520L

Type

Solder Paste Printer

Max Board Size (X×Y)

450mm × 350mm

Min Board Size (X×Y)

50mm × 50mm

PCB Thickness

0.4mm – 6mm

Template Frame Size

470×370mm to 737×737mm

Squeegee Type

Metal scraper (45°/50°/60°)

Squeegee Length

250mm / 460mm

Squeegee Thickness

0.25mm Diamond-like carbon coating

Printing Mode

Single or double scraper

Printing Speed

10 – 300 mm/s

Printing Pressure

4kg – 20kg

Cleaning Mode

Drip system; Dry, wet & vacuum

Cycle Time

<8s (excluding printing & cleaning)

Solder Paste Printer
Printing

Solder Paste Printer

HTGD · HTGD MEGA

The HTGD MEGA solder paste printer delivers fast and accurate paste printing with rapid product changeover in under 5 minutes. Supporting boards up to 450×350mm with flexible squeegee options and an efficient cleaning system, it is engineered for high-throughput SMT production lines.

Model

HTGD MEGA

Type

Solder Paste Printer

Max Board Size (X×Y)

450mm × 350mm

Min Board Size (X×Y)

50mm × 50mm

PCB Thickness

0.4mm – 6mm

Template Frame Size

470×370mm to 737×737mm

Squeegee Type

Steel / Glue scraper (45°/50°/60°)

Squeegee Length

200mm – 500mm

Squeegee Height

65 ± 1mm

Squeegee Thickness

0.25mm Diamond-like carbon coating

Printing Mode

Single or double scraper

Printing Speed

0 – 200 mm/s

Printing Pressure

0.5kg – 10kg

Cleaning Mode

Drip system; Dry, wet & vacuum

Cycle Time

<7s (excluding printing & cleaning)

Product Changeover

<5 minutes

Reflow Soldering Oven — 7 Zone
Soldering

Reflow Soldering Oven — 7 Zone

Heller · 1707 MKIII

The Heller 1707 MKIII is a precision 7-zone forced convection reflow oven offering exceptional temperature stability and control accuracy of ±0.1°C. With 14 heaters (7 top + 7 bottom) and a profile change time of 5–15 minutes, it delivers repeatable thermal profiles for consistent solder joint quality across complex multi-layer PCB assemblies.

Model

1707 MKIII (Air)

Make

Heller

Max PCB Width

18" (46cm) / 22" (56cm)

Conveyor Length

18" (46cm)

Heated Tunnel Length

70" (179cm)

Max Conveyor Speed

74"/min (188 cm/min)

Heater Zones

7 zones

Number of Heaters

TOP: 7 / BOTTOM: 7

Profile Change Time

5–15 minutes

Temperature Accuracy

±0.1°C

Temperature Range

60°C – 350°C

Cooling Zones

1

Automatic Optical Inspection (AOI)
Inspection

Automatic Optical Inspection (AOI)

Mirtech · MV3V

The Mirtech MV3V AOI system provides comprehensive automated optical inspection for SMT assemblies. Equipped with a 5.0 megapixel top-down camera and an optional 4-camera side-viewer system, it detects a wide range of defects — from lifted leads and bridge faults to polarity errors and missing components — at an inspection speed of up to 173 cm²/sec.

Model

MV3V

Make

Mirtech

Max PCB Size

500mm × 400mm

Top Camera

5.0 Mega (2456 × 2058 pixels)

Side Cameras

Optional 4-camera side-viewer

Inspection Speed

Up to 173 cm²/sec

Detectable Defects

Lifted Lead, Bridge, Wrong/Missing Component, Insufficient/Excessive Solder, Misalignment, Polarity, Tombstone, Flipped Component, OCR Recognition, Pad Scratch, Solder Balls

BGA Rework Station
Rework

BGA Rework Station

Zhuomao · ZM-R-6200

The Zhuomao ZM-R-6200 is an advanced BGA rework station featuring dual hot-air heaters and a powerful 2700W IR bottom preheater. With optical alignment, PLC-controlled temperature management, and support for BGA chips from 1×1mm to 80×80mm, it enables precise and reliable BGA reballing, removal, and replacement.

Model

ZM-R-6200

Make

Zhuomao

Top Heater

1200W hot air

2nd Heater

1200W hot air

Bottom IR Preheater

2700W IR

Control System

Touch screen + PLC + Optical alignment

Temperature Control

K-sensor closed-loop

PCB Size

Max 410×370mm / Min 65×65mm

BGA Chip Size

1×1mm to 80×80mm

PCB Positioning

V-groove with universal fixture

Wave Soldering Machine
Soldering

Wave Soldering Machine

EMS Technologies · Stallion CC PLC

The Stallion CC PLC wave soldering machine is designed for high-reliability through-hole and mixed-technology PCB assembly. Featuring an orbital O-Wave SMD option, a dual-wave pot with 225kg lead-free or 255kg leaded solder capacity, foam fluxer, and a carrier conveyor with warping prevention — it offers production-grade wave soldering performance.

Model

Stallion CC PLC

Make

EMS Technologies

Type

Wave Soldering

Fluxer

Stainless steel 5L tank, foam fluxer with porous candle

Solder Pot

Dual wave: 225kg lead-free / 255kg leaded

SMD Option

Orbital 'O-Wave' multi-jet SMD soldering

Heaters

High-reliability external plate heaters

Conveyor Angle

Manual: 3°, 4°, or 5°

PCB Support

Adjustable carrier with center rod & wire support

Wave Soldering Machine
Soldering

Wave Soldering Machine

EMS Technologies · Stallion U321

The Stallion U321 wave soldering machine delivers dependable through-hole and mixed-assembly soldering with a 2-stage IR preheating system and PID temperature control. Supporting PCBs up to 300mm wide via pallet/finger conveyor, with a lead-free compatible titanium-option solder pot and adjustable conveyor angle for optimal soldering performance.

Model

Stallion U321

Make

EMS Technologies

Type

Wave Soldering

Fluxer

Stainless steel 5L tank, foam fluxer

Solder Pot

~170kg, lead-free compatible (titanium option)

Preheating

2-stage IR preheaters with PID temperature control

Max PCB Width

300mm (pallet/finger conveyor)

Conveyor Angle

Manual: 3°, 4°, or 5°

Testing & Box Build Facility
Box Build

Testing & Box Build Facility

Flipchip Electronics · Integrated Assembly Line

Dedicated box build and testing facility supporting complete electro-mechanical assembly, subsystem integration, enclosure fitment, cable routing, functional validation, and shipment-ready packaging. Designed for reliable end-to-end product integration and quality assurance.

Facility Type

Testing & Box Build

Application

Electro-Mechanical Assembly

Capability

Functional & Burn-In Testing

Support

Packaging & Dispatch Preparation

Facility Overview

A Factory Designed Around Zero-Defect Manufacturing

Our facility is purpose-built for electronics manufacturing excellence. Every workstation, material flow path, and environmental control system has been designed to minimise contamination, operator error, and process variability.

  • ESD-controlled production floor throughout
  • Temperature & humidity-controlled SMT area
  • Separated receiving, production, and shipping zones
  • Fully traceable MES with lot-level genealogy
  • CCTV-monitored with restricted access control
  • ISO 9001 compliant quality management system
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SMT production line
Inspection equipment
Reflow soldering
X-ray inspection
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Interested in Visiting Our Facility?

We welcome OEM engineering and procurement teams for on-site audits, capability demonstrations, and facility tours. Send us an enquiry and our team will arrange a visit at your convenience.